Circuits Assembly Online Magazine - Home
The masses are atwitter over the announced Renesas acquisition of Altium, and for good reason. The $5.9 billion price tag is some real coin. What’s less clear to almost everyone outside the two companies, however, is the underlying strategy and[…]
Circuits Assembly Online Magazine - 2023 Magazine Archives
4 天之前 · Circuits Assembly Magazine online Magazine. StenTech Welcomes Jordan Owens as Chief Financial Officer; Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
Circuits Assembly Online Magazine - News
2025年1月17日 · Circuits Assembly Magazine online Magazine. MILPITAS, CA – The semiconductor industry is expected to start 18 new fab construction projects in 2025, according to SEMI’s latest quarterly World Fab Forecast report.
IMI to Close Chengdu Production Facility
1 天前 · BIÑAN, PHILIPPINES – Integrated Micro-Electronics has announced the closure of its Chengdu, China, manufacturing facility as part of its ongoing efforts to streamline operations and reduce costs. The move comes as the company works to …
Circuits Assembly Online Magazine - Semiconductor Equipment …
2024年12月10日 · Circuits Assembly Magazine online Magazine. TOKYO – Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $113 billion in 2024 and growing 6.5% year-over-year, SEMI announced in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2024.
Circuits Assembly Online Magazine - PVA to Showcase Delta 8 …
1 天前 · HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is excited to announce its participation in Southern Manufacturing & Electronics 2025. The company will be exhibiting with its UK representative, Altus Group, at Stand #J80. Pieter Van Der Vorst, PVA’s Europe ...
Circuits Assembly Online Magazine - Magazine
2025年1月6日 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.
Circuits Assembly Online Magazine - 2022 Magazine Archives
Circuits Assembly Magazine online Magazine. AIM Solder Promotes Kelly Cardone to Vice President, Customer Experience
Filling the Gap: Underfill Materials Dispensing for Electronics
2024年12月3日 · The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit.
Identifying Solder Mask Problems with Simple Tests - Circuits …
2024年8月30日 · Diagnosing sources of crazing, delamination and peeling. In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, designed to shield the copper surfaces and prevent solder bridging between components, plays a crucial role in ensuring the reliability and functionality of electronic devices.