Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Two case studies show the effectiveness of high-res 3D ...

Atlanta, Ga - The global leader in Thermal Warpage Metrology, announces financial results for the full year 2024. "We are pleased to report outstanding performance in both Engineering Development and ...

Experts At The Table: What's needed to be able to trust that a RISC-V implementation will work as expected across multiple designs using standard OSes. Semiconductor Engineering discussed the issue ...

Processor performance continues to improve exponentially, with more processor cores, parallel instructions, and specialized processing elements, but it is far outpacing improvements in bandwidth and ...

Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...

Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago, to address issues in PCB flatness, using the shadow moiré warpage measurement technique. ... This paper studies board ...