And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

However, not all chips perform equally, even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed ...

During the gradual move from 28nm down to 3nm, Apple’s die size hasn’t grown much ... that estimates regarding wafers can be tricky, as wafer yields vary, and TSMC may have financial ...

Detailed price information for Aehr Test Systems (AEHR-Q) from The Globe and Mail including charting and trades.

Teradyne said it agreed to acquire Quantifi Photonics, a privately-held photonic IC testing company. Teradyne said Monday the acquisition will enable it to deliver scalable photonic integrated circuit ...