Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

“The paste used in this structure is cured at low temperatures during the lamination process, making it suitable ... were conducted on M2+ commercial metallization-free heterojunction solar ...

Along with others he continued to develop the technology, arriving at the “horizontal double-sided copper metallization” (HD Plate) process the business is now looking to introduce to solar ...