LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...

The proposed metallization process is based on glass stencils provided by LPKF Laser & Electronics SE. These stencils rely on the so-called LIDE technology, which is a two-step process that ...

“The paste used in this structure is cured at low temperatures during the lamination process, making it suitable ... were conducted on M2+ commercial metallization-free heterojunction solar ...

Parasitics are introduced during the physical manufacturing process in semiconductor foundries, affecting both IC devices and their interconnects (Figure 1). Figure 1. Interconnect parasitic ...

The initial attosecond dynamics behind this metallization are not entirely understood. Therefore, simulations are needed to understand this process and to help interpret experimental observations of ...

I attended IEDM in San Francisco in December. There were two presentations about TSMC’s N3 process. This is actually a bit of a misnomer since TSMC has two N3 processes, one simply called N3. The ...