As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 ...

Patrick describes how this major milestone offers precision, material flexibility, and scalability for semiconductor advanced packaging – including die-attach applications, dispensing ultra-small ...

SANTA CLARA, Calif., Feb. 7, 2025 /PRNewswire/ -- LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal ...

According to ijiwei, numerous senior executives at affected Chinese IC design companies have confirmed this directive. Companies with certified packaging partners will experience minimal ...

LQDX Inc. has expanded its partnership with Arizona State University (ASU) to advance semiconductor packaging innovation. LQDX will provide its liquid metal ink technology to ASU’s new CHIPS-funded ...

The board could also decide to build capacity in the U.S. for advanced packaging, which Taiwan Semiconductor has kept in Taiwan, FT cited unnamed sources familiar with the matter. Although North ...

“It’s not about reducing capacity. It’s actually increasing capacity into CoWoS-L.” Nvidia’s foray into new technology is a stark reminder of how quickly advanced packaging needs are changing.

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

Vietnam has scored another victory in its bid to move beyond back-end assembly and packaging and establish an IC design and testing presence. Mixel, an analog and mixed-signal IP developer, is opening ...