A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. Abstract ...

Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States Department of Chemical Engineering, The Pennsylvania State University, University Park, ...

Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China ...