A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. Abstract ...

Department of Physics, Chungbuk National University, Cheongju 28644, Republic of Korea Basic Science Research Institute, Chungbuk National University, Cheongju 28644, Republic of Korea ...

Department of Applied Physics and Research Institute for Advanced Manufacturing, The Hong Kong Polytechnic University, Hung Hom, Hong Kong 999077, China ...