Alpha and Omega Semiconductor Limited (NASDAQ:AOSL) Q2 2025 Management View CEO Stephen Chang highlighted that Q2 revenue and EPS met guidance, with revenue reaching $173.2M and non-GAAP EPS at $0.09.

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Group company specializing in consumer logic IC packaging and testing, has reported better-than-expected... Save my User ID and Password Some subscribers prefer to save their log-in information so ...

As such, we expect demand to remain high for our core technologies, including fast-turn IC packaging and assembly, advanced assembly services (stacked die, flip-chip, SIP, etc.) and back-end wafer ...

The workstations have been designed for a variety of sectors. Credit: BOSTONtec/PR Newswire. BOSTONtec, a manufacturer of ergonomic workstations, has unveiled its new line of packaging stations, ...

(MENAFN- GlobeNewsWire - Nasdaq) The global panel level packaging market size to hit USD 11.13 billion by 2033, growing from USD 0.81 billion in 2025, increasing at 38.60% CAGR from 2025 to 2033.

Agentic AI has been considered as one of the key trends shaping the generative AI space for 2025. Its applications are supporting workflows and enhancing productivity across various sectors ...

GlobalFoundries has unveiled plans to invest US$575 million in a cutting-edge advanced packaging and photonics center at its Malta, New York, facility. This ambitious project is designed to enable ...

SemiAccurate reported that a couple of months ago it saw an email saying that a potential buyer for the whole operation with enough money to pay for it was interested in acquiring the company as a ...

To have a stake in the silicon photonics supply chain, TSMC and Taiwan-based IC packaging and testing services provider ASE Technology Holding Co (日月光投控) have organized the Silicon Photonics Industry ...