Label-Aire's (Fullerton, CA) Model 2111ST Reverse Vac Blow labeler has a 10" drop-down snorkel for applying electronic article sur- veilance label sensors at speeds to 400 cycles/ min. Jan 31, 1996 ...

Custom substrates for prototype development and production, particularly for SSD's, power and RF devices.

Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven) Featuring 8kV ESD protection, this library ensures robust reliability in ...

Group company specializing in consumer logic IC packaging and testing, has reported better-than-expected... Save my User ID and Password Some subscribers prefer to save their log-in information so ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

RRP Electronics, backed by cricket legend Sachin Tendulkar has partnered with Deca Technologies, a US-based leader in semiconductor packaging. This collaboration aims to strengthen ... working on the ...

本方案使用的 Nano120 系列通过 EMV 2000 和中国 PBOC3.0 of Level 1 接触式认证，使用于 USB 转账支付读卡器，且具有 ISO7816-3x3 智能卡界面、防篡改检测管脚、防盗拷锁码位功能、96-bit UID 芯片唯一码、128-bit UCID 客户唯一码、抗干扰能力强 (8kV ESD，EFT 4kV) 等特色。

Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven) Featuring 8kV ESD protection, this library ensures robust reliability in ...

SE: IC packaging isn’t new, but years ago it was largely in the background. A package simply encapsulated and protected a chip. Recently, packaging has become more important. What changed? Kelly: ...