Sandisk's upcoming 3D Matrix Memory promises DRAM-like performance at four times the capacity and half the cost.

In DRAM chips, besides access transistors, peripheral transistors must meet stringent requirements which preclude a ...

Among the things that Sandisk discussed last week at its Investor Day were upcoming UltraQLC-based 1PB (1 petabyte) ...

Roadmap opened SanDisk has been discussing its roadmap to build an UltraQLC-based 1PB solid-state drives (SSDs) and discussed ...

DRAM maker ChangXin Memory Technologies (CXMT) revealed its 16 Gb DDR5 chips to the market. The devices made domestically have a chip size measuring 66.99 mm2, resulting in a 0.239 Gb/mm2 bit density.

When you buy through links on our articles, Future and its syndication partners may earn a commission.

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Traditionally, ANNS algorithms are deployed in DRAM to achieve the high-speed ... Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density ...

Winbond Electronics Corp (華邦電) yesterday said demand for its tailor-made DRAM and NOR flash memory chips is expected to ...

Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...