Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...

SimForm, the leading cloud-based simulation software for mold design, is pleased to announce a significant expansion of its ...

While climate risks grows, so does research, development and investment in better products and designs to protect our homes, ...

Atlanta, Ga - The global leader in Thermal Warpage Metrology, announces financial results for the full year 2024. "We are pleased to report outstanding performance in both Engineering Development and ...

Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.

Read our review of the Prusa Pro HT90, Prusa Research's first step into engineering materials and the entry-level industrial ...

Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...

DVFS has been used in smart phones for more than a decade as a way of trading off power and performance when both are constrained, but much of the semiconductor industry has avoided this technique ...

The "Polybutylene Terephthalate (PBT) - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's ...

Rescuing and restoring decaying 16mm footage of the blacklisted Hollywood 10 for a documentary, detailing Blake Jones' ...

As the number of HBM layers increases, bonding equipment becomes even more critical. For example, in the 12-layer HBM3E process, the thinner chip dies require slight heat application during bonding to ...