Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...
SimForm, the leading cloud-based simulation software for mold design, is pleased to announce a significant expansion of its ...
While climate risks grows, so does research, development and investment in better products and designs to protect our homes, ...
Atlanta, Ga - The global leader in Thermal Warpage Metrology, announces financial results for the full year 2024. "We are pleased to report outstanding performance in both Engineering Development and ...
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Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.
Read our review of the Prusa Pro HT90, Prusa Research's first step into engineering materials and the entry-level industrial ...
Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...
DVFS has been used in smart phones for more than a decade as a way of trading off power and performance when both are constrained, but much of the semiconductor industry has avoided this technique ...
The "Polybutylene Terephthalate (PBT) - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's ...
Rescuing and restoring decaying 16mm footage of the blacklisted Hollywood 10 for a documentary, detailing Blake Jones' ...
As the number of HBM layers increases, bonding equipment becomes even more critical. For example, in the 12-layer HBM3E process, the thinner chip dies require slight heat application during bonding to ...
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