Detecting macro-defects on wafers and tracing them to their root cause is getting easier due to tool improvements and ...

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

Introduction Semiconductor manufacturing is an intricate process that demands exceptional precision and accuracy. Robotics plays a pivotal role in ensuring seamless operations, performing essential ...

The evolution in semiconductor technology that builds a gigantic circuit on an entire wafer. Just as the integrated circuit eliminated cutting apart thousands of transistors from the wafer only to ...

The introduction of the double-sided wafer probe test cell is expected to ... this solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO ...