As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 ...
SANTA CLARA, Calif., Feb. 7, 2025 /PRNewswire/ -- LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal ...
LQDX Inc. has expanded its partnership with Arizona State University (ASU) to advance semiconductor packaging innovation. LQDX will provide its liquid metal ink technology to ASU’s new CHIPS-funded ...
According to ijiwei, numerous senior executives at affected Chinese IC design companies have confirmed this directive. Companies with certified packaging partners will experience minimal ...
“It’s not about reducing capacity. It’s actually increasing capacity into CoWoS-L.” Nvidia’s foray into new technology is a stark reminder of how quickly advanced packaging needs are changing.
The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...
Vietnam has scored another victory in its bid to move beyond back-end assembly and packaging and establish an IC design and testing presence. Mixel, an analog and mixed-signal IP developer, is opening ...
RRP Electronics, backed by cricket legend Sachin Tendulkar has partnered with Deca Technologies, a US-based leader in semiconductor packaging. This collaboration aims to strengthen India’s ...
We are seeing several issues affecting the semiconductor industry as we enter the new year with geopolitical volatility and economic uncertainty, and the overall growth in the market conceals a big ...
Taiwan Semiconductor guided that “Foundry 2.0” TAM, which includes conventional foundry, advanced packaging, and testing, will grow by 10% in 2025 (versus 6% in 2024). Since Taiwan ...
Nvidia’s Blackwell AI chip leverages Taiwan Semiconductor’s CoWoS advanced packaging technology. Also Read: Taiwan Semiconductor Q4 Earnings: 3nm and 5nm Nodes Lead Topline Growth, Expands ...