在智能设备领域，兴森科技近日在互动平台上透露，其新研发的CSP（Chip Scale Package）封装基板正主要应用于存储芯片、射频芯片以及MEMS（Micro-Electro-Mechanical Systems）芯片等多个领域。随着对高性能芯片的需求不断增加，这一创新技术无疑为设备制造商提供了更强的设计和应用自由度。

Microelectromechanical systems (MEMS) technology has allowed the realization of cost-effective, high-performance deformable mirrors for adaptive-optics-enhanced imaging. The idea of using an array ...

LAKEWOOD, Ohio -- Beginning next school year, the West Shore Career-Technical District will offer a microelectromechanical systems (MEMS) program. “Microelectromechanical systems is a two-year ...

optimized for high-condensation environments 4-in-1 MEMS sensor measures gases, humidity, temperature and barometric pressure in a compact package Offers up to 50 % reduction in power consumption ...