Indium Corpor ation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics ... Manager for East China Leo Hu is scheduled ...

Low-Temperature Bonding and High Heat Resistance Required for Power Semiconductors to Contribute to Heat Management As large-area bonding is possible, besides application as a die attachment ...

CLINTON, NY – Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, ...

It is at best, a longshot, but one that’s emerged among a group of die-hard bond traders – that the US Federal Reserve’s next move on interest rates will be up, not down. The wager ...

Semiconductor Packaging equipment: - Die Bonder/Mounting Machine - Wire Bonding Machine - Formic Acid Reflow Oven- Sintering Furnace - Aluminum/Copper Wire Bonding Machine - Dispensing ...

Abstract: Creep plays a significant role in the deterioration of solder layers particularly over extended periods of heating, even though numerous existing studies focused on the mechanism of fatigue ...