JXTC is introducing a copper plating process it says avoids the risk ... during processing led to a much lower cell breakage rate. “Silicon wafers are fragile, particularly as they keep getting ...
Through-silicon vias (TSVs) enable shorter interconnect lengths ... continuous liners and barrier metals are tougher to deposit, and copper plating must be more precisely controlled to ensure reliable ...
Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a protective barrier that reportedly reduces corrosion ...
Copper-nickel-silicon (Cu-Ni-Si) alloys are increasingly recognized for their unique combination of high strength and excellent electrical conductivity, making them valuable in various industrial ...
Experts at the Table: Semiconductor Engineering sat down to discuss the increasing importance of functional test, especially in high-performance computing, with Klaus-Dieter Hilliges, V93000 platform ...