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7 天
消息:美国晶片巨擘格芯探讨与台湾联华电子合并
世界第三大晶圆代工公司,美国格芯(GlobalFoundries)探讨与台湾联华电子(UMC)合并,但是否成事还是个未知数。 彭博社星期二(4月1日)报道,格芯有意与台湾第二大晶片制造商联华电子合并,此举是一项长期交易的一部分,旨在创建一家更具韧性的半导体 ...
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