Cambridge Sensoriis, has extended the capabilities of its proprietary Active Radar Cooperating (ARC) system for UAVs.

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

EnSilica awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (C-LEO) programme.

binder is strategically expanding its connector portfolio to address the needs of rail and transport applications ...

The Agilex eSOM7 Apollo MxFE Development Platform with the eSOM7-2F (2x F-tile) is available for order now through Hitek ...

BOW, the universal robotics software company, has successfully closed a £4 million seed round.

Silicon Labs has introduced two new SoCs, the BG22L and BG24L, for Bluetooth LE connectivity, with the BG24L Bluetooth 6.0 ...

PseudolithIC, a US company specialising in RF (radio frequency) chipset products, has successfully raised $6 million.

The OPTIGA Connect Consumer OC1230’s security architecture is based on Arm v8 and Infineon’s Integrity Guard 32 technology ...

KIOXIA has announced the open-source release of its new All-in-Storage ANNS with Product Quantization (AiSAQ) technology.

Quantum Science, a developer of infrared QD technology, is expanding into a new state-of-the-art manufacturing facility.

Syslogic’s Rugged Computer RSA4NA unlocks new opportunities for generative AI models following a power upgrade.