And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
Hosted on MSN1d
UF 120LA: The Next-Generation High Reliability, 100% Flux Residue Compatible and Reworkable UnderfillYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...
WLCSP stands for Wafer Level Chip Scale Packaging; the A30 is also available in other packages such as HVQFN20. The NXP EdgeLock A30 Secure Authenticator communicates via I2C bus. It contains a ...
Compared to an 8-bit ATTiny20 also available in WLCSP package, this is a notable increase in specs, with a way more powerful CPU, 16 times as much RAM and 8-16 times the flash! Not to mention that ...
NXP recently launched the EdgeLock A30 Secure Authenticator chip, a Common Criteria EAL 6+ certified secure authentication ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback