It also demonstrated that the curvature of the saw marks on the ... large-size ultra-thin silicon wafers and reducing the fracture probability in the production process,” the academics said.

The company uses molten silicon to form wafers rather than sawing ingots, thus eliminating dust waste and speeding up the process. A spokesperson for the company told pv magazine it is exploring ...

TSMC's quote for a 300-mm wafer process using its N2 technology will ... 10% to 15% (at the same power and complexity), while also cutting power consumption by 25% to 30% (at the same clocks ...