来自MSN14 天
GVT speeds up expansion in front-end semiconductor market after bagging TSV project
It was awarded by a global leader in wafer fabrication equipment and services. Grand Venture Technology Limited (GVT) has fast-tracked its expansion into the front-end semiconductor market after it ...
Semiconductor Engineering19 天
3D Integration And Test Results From TSV-Processed Chips (CERN et al.)
These challenging requirements can be met using 3D interconnect techniques widely used in industry. In this paper, we present the results of an evaluation of the 3D Through-Silicon-Via (TSV) ...