ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture ...

The University of Strathclyde has received £9 million from Innovate UK to pursue semiconductor packaging R&D. The intention is to provide an advanced packaging line for power electronic semiconductors ...

Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering (ASE), ...