To obtain anisotropic profiles, the DSiE technique or the Deep Reactive Ion Etching (DRIE) repeatedly integrates isotropic silicon ... as it offers a low-temperature process (−110 °C). Atomic Layer ...
High etch rates often come at the cost of reduced selectivity ... Applications of High-Aspect-Ratio Microfabrication Journal of Sensor Science and Technology, Optimization of Etching Profile in ...
To improve data storage, researchers are perfecting 3D NAND flash memory, which stacks cells to maximize space. Researchers ...
At least that’s [Sam]’s plan, which his new reactive-ion etching setup aims to make possible ... sits a vacuum chamber for the wafer to be etched. After evacuating the air, a small amount ...
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The narrow, deep holes required for this type of memory can be etched twice as fast with the right plasma and other key ...
(Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types based on the etching mechanism and the resulting profile: It's worth noting that wet ...