近日，深圳市兴联昌电子有限公司获得了一项名为“一种高防护的BGA测试探针”的专利。这项专利的发布标志着在BGA（Ball Grid Array）测试探针领域的一项重要技术突破，不仅提升了测试的精度，也为行业内的设备使用带来了新的可能性。该专利的授权公告号为CN222353971U，申请日期为2024年4月。

Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

盖世汽车讯 5月16日，创新存储和内存解决方案供应商Exascend宣布推出AS500系列NVMe Ball Grid Array固态硬盘（BGA SSD）。该AS500专为满足下一代互联和自动 ...

The Bermuda Golf Association’s 2025 season teed off in style with the Bermuda Four-Ball Championships at Port Royal Golf Course. This year’s event holds extra significance as it marks the BGA’s 75th ...

The next BGA event is the Bermuda Four-Ball Championships, which is scheduled to take place on February 1 and 2 at Port Royal Golf Course, with registration now open.