Until 2018, DRAM peripheral transistors were predominantly made in planar logic MOSFET technology with poly-Si/SiO 2 or ...

In DRAM chips, besides access transistors, peripheral transistors must meet stringent requirements which preclude a ...

Among the things that Sandisk discussed last week at its Investor Day were upcoming UltraQLC-based 1PB (1 petabyte) ...

Roadmap opened SanDisk has been discussing its roadmap to build an UltraQLC-based 1PB solid-state drives (SSDs) and discussed ...

DRAM maker ChangXin Memory Technologies (CXMT) revealed its 16 Gb DDR5 chips to the market. The devices made domestically have a chip size measuring 66.99 mm2, resulting in a 0.239 Gb/mm2 bit density.

Lam Research Corp. has rolled out what it claims is an advanced plasma conductor etch tool needed for 3D chipmaking. Called ...

The "big three" in the DRAM industry are preparing to end production of DDR3 and DDR4 memory solutions this year. Samsung Electronics, SK Hynix, and Micron ...

New Lam Research tools Akara and ALTUS Halo for building AI chips offer advanced plasma etch and ALD capabilities for complex ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Samsung Electronics is set to introduce its next-gen LPW DRAM: touted as 'mobile HBM' optimized for on-device AI of the ...

Winbond Electronics Corp (華邦電) yesterday said demand for its tailor-made DRAM and NOR flash memory chips is expected to ...

Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...